Packaging innovation for space applications - with Texas Instruments
Episode 62 of the Space Industry podcast is a discussion with Adrian Helwig, Analog Field Application Engineer, and Michael Seidl, Systems Engineer from Texas Instruments, about the packaging of electronic components for space.In the episode we cover:The benefits of using plastic packages vs. ceramic packagingThese include SWaP+C advantages, simpler production with no forming or trimming of lead frame required, and pin-compatibility between quality classesThe role that Texas Instruments has played in supporting the standardization of QMLPHow and why TI will continue to offer QMLV-RHA (ceramic) packagingHow TI supports its space customers, with a catalog business approach, in order to enable rapid and predictable design execution, with strong supply capabilitiesYou can find out more about Texas Instruments here on their satsearch supplier hub.And if you would like to learn more about the space industry and our work at satsearch building the global marketplace for space, please join our newsletter.[Music from Uppbeat (free for Creators!): https://uppbeat.io/t/all-good-folks/when-we-get-there License code: Y4KZEAESHXDHNYRA]